In recent years, there has been tremendous progress, technologically and in terms of demand, in electronic devices and systems. The technological progress has come on two main fronts increased functionality on a single device unit and miniaturization of each unit. Both of these developments have increased the need for thermal management technologies.
“Thermal management” is the term used to describe the array of material technologies and problem-solving design tools that systems manufacturers apply to regulate the unwanted heat caused by the normal functioning of an electronic system.
This report segments thermal management technologies into four segments hardware, software, interfaces and substrates.
The hardware segment includes several product subsegments, including heat sinks, fans and blowers, fan sinks, heat pipes and cold plates. These segments were chosen because they are established technologies and represent revenue markets of significant size.
The software segment consists of electronic design software designed to model and analyze the thermal characteristics of an electronic system design. Specific types of thermal management software examined in this study include computational fluid design (CFD), computational heat transfer (CHT), power management, circuit design and other electronic design automation (EDA).
Thermal management interface materials are products that stand between a heat sink and the device to be cooled, where their function is to improve the thermal transfer in the joint between the heat sink and the device to be cooled by increasing or securing the area of contact between the two surfaces. In some cases, the interface actually performs the job of the heat sink. This role has become increasingly common in a number of applications in which, due to the height or weight constraints of the system, a conventional hardware heat sink is not feasible.
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Finally, the report analyzes substrates, which are the foundations of integrated circuits (ICs), or planar components of electronic packages or modules. The report focuses on substrates that have been developed specifically to enhance the thermal handling capability of an electronic component.
Study Goal and Objectives
This report is an update of an earlier BCC Research report prepared in 2011. The overall goal of this updated report is to provide an analysis of the most recent developments and current trends in the global thermal management marketplace. Specific objectives include:
The scope of this report is broad, covering several product areas. The individual materials, hardware and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issues for that product segment, and are projected for five years from 2012 to 2017. The application sections feature forecasts for the most important applications by product.
The technology discussion concentrates on trends that will develop more significantly during the forecast period. The report also includes a discussion on the competitive aspects of each product segment, along with several successful suppliers’ strategies in the market. A current industry directory, a survey of recent U.S. thermal management patents and patent applications pending, and profiles of a selection of the leading thermal management suppliers are also included.
The report addresses the global market for thermal management products during the period from 2011 through 2017, including:
Methodology
The findings and conclusions of this report are based on information gathered from a variety of sources, using both primary and secondary research methodologies. Sources of information include Internet searches and industry association data, and interviews conducted with thermal management component suppliers, custom engineering companies and manufacturers of representative applications. In addition, other secondary sources were consulted for the report, including industry journals and publications, product literature, white papers and technical journals, and financial reports for industry suppliers.
The base year for analysis and projection is 2011. With 2011 as a baseline, market projections were developed for 2012 and 2017. These projections are based on a combination of a consensus among primary contacts combined with our understanding of key market drivers and their impact from a historical and analytical perspective. The analytical methodologies used to generate the market estimates are described in detail in the market analysis. All dollar projections presented in this report are in 2011 constant dollars.
Contact sales@reportsandreports.com for more information.
“Thermal management” is the term used to describe the array of material technologies and problem-solving design tools that systems manufacturers apply to regulate the unwanted heat caused by the normal functioning of an electronic system.
This report segments thermal management technologies into four segments hardware, software, interfaces and substrates.
The hardware segment includes several product subsegments, including heat sinks, fans and blowers, fan sinks, heat pipes and cold plates. These segments were chosen because they are established technologies and represent revenue markets of significant size.
The software segment consists of electronic design software designed to model and analyze the thermal characteristics of an electronic system design. Specific types of thermal management software examined in this study include computational fluid design (CFD), computational heat transfer (CHT), power management, circuit design and other electronic design automation (EDA).
Thermal management interface materials are products that stand between a heat sink and the device to be cooled, where their function is to improve the thermal transfer in the joint between the heat sink and the device to be cooled by increasing or securing the area of contact between the two surfaces. In some cases, the interface actually performs the job of the heat sink. This role has become increasingly common in a number of applications in which, due to the height or weight constraints of the system, a conventional hardware heat sink is not feasible.
Buy a copy of this report @ http://www.reportsnreports.com/reports/71003-the-market-for-thermal-management-technologies.html
Finally, the report analyzes substrates, which are the foundations of integrated circuits (ICs), or planar components of electronic packages or modules. The report focuses on substrates that have been developed specifically to enhance the thermal handling capability of an electronic component.
Study Goal and Objectives
This report is an update of an earlier BCC Research report prepared in 2011. The overall goal of this updated report is to provide an analysis of the most recent developments and current trends in the global thermal management marketplace. Specific objectives include:
- Identifying thermal management technologies and products with the greatest commercial potential in the near to mid-term (2012–2017).
- Analyzing the key drivers and constraints that will shape the market for thermal management technologies and products over the next five years.
- Estimating the current and future demand for thermal management technologies and products.
- Ascertaining the companies that are best positioned to meet this demand because of proprietary technologies, strategic alliances or other advantages.
The scope of this report is broad, covering several product areas. The individual materials, hardware and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issues for that product segment, and are projected for five years from 2012 to 2017. The application sections feature forecasts for the most important applications by product.
The technology discussion concentrates on trends that will develop more significantly during the forecast period. The report also includes a discussion on the competitive aspects of each product segment, along with several successful suppliers’ strategies in the market. A current industry directory, a survey of recent U.S. thermal management patents and patent applications pending, and profiles of a selection of the leading thermal management suppliers are also included.
The report addresses the global market for thermal management products during the period from 2011 through 2017, including:
- Thermal management hardware.
- Thermal management software.
- Thermal management interface products.
- Thermal management substrates.
- Executive Summary.
- Thermal management industry overview.
- Thermal management products major segments, subsegments, technology trends, applications, world market estimates and projections.
- Industry structure market shares and company profiles.
- Patent analysis.
Methodology
The findings and conclusions of this report are based on information gathered from a variety of sources, using both primary and secondary research methodologies. Sources of information include Internet searches and industry association data, and interviews conducted with thermal management component suppliers, custom engineering companies and manufacturers of representative applications. In addition, other secondary sources were consulted for the report, including industry journals and publications, product literature, white papers and technical journals, and financial reports for industry suppliers.
The base year for analysis and projection is 2011. With 2011 as a baseline, market projections were developed for 2012 and 2017. These projections are based on a combination of a consensus among primary contacts combined with our understanding of key market drivers and their impact from a historical and analytical perspective. The analytical methodologies used to generate the market estimates are described in detail in the market analysis. All dollar projections presented in this report are in 2011 constant dollars.
Contact sales@reportsandreports.com for more information.
