The report provides a temporary wafer bonding equipment forecast which shows that 10% of the total thin wafer shipment will experience a temporary bonding step by 2017. So, while temporary bonding equipment is still a small market today, it is expected to grow as the need for thin wafer handling grows. In fact, we estimate the market for temporary bonding tools to be more than $250M by 2017. Currently, shipped bonder/debonders are for Power and 3D ICs applications. However, we believe 3D ICs will become the predominant application for temporary bonders > 2015.
Thin wafer handling will enjoy increased importance in the coming years, but as chips get thinner and wafer diameter increases, thinning/handling procedures are required. This implies development in wafer thinning, wafer dicing and wafer temporary bonding.
Temporary bonding implies know-how in process and chemistry, and an understanding of the final application requirements. Temporary bonding is a complex technology, requiring an interface material (sometimes called the “Magic” material) that is strong enough to withstand post-processing but which can be easily removed afterwards. As the main concern for temporary bonding materials (wax, tape or glue) is temperature stability, the material must be strong enough to withstand processing steps (metallization, etching, grinding). Another issue is the choice of carrier material. Carrier lifetime depends on its capability to withstand steps such as grinding, etc., and carrier lifetime should be at least tens of times, though this is not yet the case today.
Price:Single User License:US$5390 Corporate User License:US$7990
Thin wafer handling will enjoy increased importance in the coming years, but as chips get thinner and wafer diameter increases, thinning/handling procedures are required. This implies development in wafer thinning, wafer dicing and wafer temporary bonding.
Temporary bonding implies know-how in process and chemistry, and an understanding of the final application requirements. Temporary bonding is a complex technology, requiring an interface material (sometimes called the “Magic” material) that is strong enough to withstand post-processing but which can be easily removed afterwards. As the main concern for temporary bonding materials (wax, tape or glue) is temperature stability, the material must be strong enough to withstand processing steps (metallization, etching, grinding). Another issue is the choice of carrier material. Carrier lifetime depends on its capability to withstand steps such as grinding, etc., and carrier lifetime should be at least tens of times, though this is not yet the case today.
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Report Details:
Published: October 2012Price:Single User License:US$5390 Corporate User License:US$7990
OBJECTIVES OF THE REPORT
Provide an understanding of the thin wafers application:
Market Forecasts for temporary bonding in US$ value and number of equipment:
Overview of the different temporary bonding approaches, i.e.:
Provide an understanding of the thin wafers application:
- Overview of thin wafers applications: MEMS, CMOS Image Sensors, Memory, Power Devices, RF Devices, LEDs, Interposers, Photovoltaics
- Thin wafers roadmap
- 2011-2017 Market Forecast in units and US$ for thin wafers
- Detailed forecasts by application, wafer size and thickness
Market Forecasts for temporary bonding in US$ value and number of equipment:
- By application
- By wafer size
Overview of the different temporary bonding approaches, i.e.:
- Without carrier:
- TAIKO
- DoubleCheck Semiconductors
- With Carrier:
- UV laser released
- Electrostatic
- Thermal release
- Mechanical release
- Chemical release
- Temporary bonding trends
- Thinning trends
- Dicing trends
