The global electronic components market reached 3.4 billion pounds in 2011. It is expected to reach 3.5 billion pounds in 2012 and it will further grow to 4.4 billion pounds by 2017, a compound annual growth rate (CAGR) of 4.7%
The thermoplastic market reached 2.3 billion pounds in 2011. It is expected to reach 2.5 billion pounds in 2012 and it will further grow to 3.1 billion pounds by 2017, a CAGR of 4.9%
The thermoset market is expected to reach nearly 1.1 billion pounds in 2012 and it will further grow to 1.3 billion pounds by 2017, CAGR of 4.3%
SCOPE AND FORMAT
This study covers all electronic components where plastics are used to a significant extent in mostly molding electronic components and excludes fiber optics, wire and cable, enclosures, recording media, etc. This study covers single devices (e.g., connectors, capacitors, switches, bobbins), multiple-component devices (e.g., printed circuit boards, interconnects, etc.) and encapsulants.In addition, key participants in the electronic components industry in terms of resin producers, and molders are identified along with inclusion of key technologies, and the competitive resin scenario.
METHODOLOGY
A comprehensive review was undertaken of literature relating to resins used to produce electronic components, their applications, technology, markets and new developments. Included in the review were supplier trade literature, texts, and monographs. Unresolved issues were clarified by contact with those involved in the industry.
Published: February 2012
No. of Pages: 238
Price: Single User License: US$ 4850 Corporate User License: US$ 8500
OBJECTIVES
This study focuses on plastics usage in electronic components; however, it is not a review of the electronic industry but deals with development of resins and resin grades to meet requirements of these electronic products used in computers, telecommunications, automotive, and other major industries employing these electronic components.
REASONS FOR DOING THE STUDY
Resin consumption in electronic components had been growing at rates well above the Gross Domestic Product (GDP) for many years. Aside from the recent “economic recovery,” there has been continued demand for electronic products, proliferation of new technologies, and “handling” of environmental pressures brought to bear on the industry has resulted in the need, in many instances, for higher performance plastics for many electronic components. Thus, it is appropriate for a new appraisal of this market at this time.
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The thermoplastic market reached 2.3 billion pounds in 2011. It is expected to reach 2.5 billion pounds in 2012 and it will further grow to 3.1 billion pounds by 2017, a CAGR of 4.9%
The thermoset market is expected to reach nearly 1.1 billion pounds in 2012 and it will further grow to 1.3 billion pounds by 2017, CAGR of 4.3%
SCOPE AND FORMAT
This study covers all electronic components where plastics are used to a significant extent in mostly molding electronic components and excludes fiber optics, wire and cable, enclosures, recording media, etc. This study covers single devices (e.g., connectors, capacitors, switches, bobbins), multiple-component devices (e.g., printed circuit boards, interconnects, etc.) and encapsulants.In addition, key participants in the electronic components industry in terms of resin producers, and molders are identified along with inclusion of key technologies, and the competitive resin scenario.
METHODOLOGY
A comprehensive review was undertaken of literature relating to resins used to produce electronic components, their applications, technology, markets and new developments. Included in the review were supplier trade literature, texts, and monographs. Unresolved issues were clarified by contact with those involved in the industry.
Global electronic components market
Published: February 2012
No. of Pages: 238
Price: Single User License: US$ 4850 Corporate User License: US$ 8500
OBJECTIVES
This study focuses on plastics usage in electronic components; however, it is not a review of the electronic industry but deals with development of resins and resin grades to meet requirements of these electronic products used in computers, telecommunications, automotive, and other major industries employing these electronic components.
REASONS FOR DOING THE STUDY
Resin consumption in electronic components had been growing at rates well above the Gross Domestic Product (GDP) for many years. Aside from the recent “economic recovery,” there has been continued demand for electronic products, proliferation of new technologies, and “handling” of environmental pressures brought to bear on the industry has resulted in the need, in many instances, for higher performance plastics for many electronic components. Thus, it is appropriate for a new appraisal of this market at this time.
Click to Browse all research reports of Semiconductor and Electronics
